SAE AMS3684 PDF

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RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled

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Description

This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

History

AMS3684C	2016-10-13	Latest	Stabilized
AMS3684B	1993-01-01	Historical	Noncurrent
AMS3684A	2011-08-12	Historical	Reaffirmed
AMS3684	1975-09-01	Historical	Issued

ISSUING COMMITTEE	AMS P Polymeric Materials Committee
DATE	1975-09-01
DOI	https://doi.org/10.4271/AMS3684
ISCURRENT
PAGE	4
PUBLISHER	SAE International
REVISED	ISSUED