SAE AMS3684 PDF
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RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled
Description
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
History
| AMS3684C | 2016-10-13 | Latest | Stabilized |
| AMS3684B | 1993-01-01 | Historical | Noncurrent |
| AMS3684A | 2011-08-12 | Historical | Reaffirmed |
| AMS3684 | 1975-09-01 | Historical | Issued |
| ISSUING COMMITTEE | AMS P Polymeric Materials Committee |
|---|---|
| DATE | 1975-09-01 |
| DOI | |
| ISCURRENT | |
| PAGE | 4 |
| PUBLISHER | SAE International |
| REVISED | ISSUED |
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