SAE AMS3731/10A PDF
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POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
Description
This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
History
| AMS3731/10C | 2017-11-29 | Latest | Stabilized |
| AMS3731/10B | 1993-01-01 | Historical | Noncurrent |
| AMS3731/10A | 1987-10-01 | Historical | Revised |
| AMS3731/10 | 1981-10-01 | Historical | Issued |
| ISSUING COMMITTEE | AMS P Polymeric Materials Committee |
|---|---|
| DATE | 1987-10-01 |
| DOI | |
| PAGE | 3 |
| PUBLISHER | SAE International |
| REVISED | REAFFIRMED |
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