SAE ARP1612 PDF
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POLYIMIDE PRINTED CIRCUIT BOARDS
Description
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards.
History
| ARP1612A | 2022-06-05 | Latest | Reaffirmed |
| ARP1612 | 1979-10-01 | Historical | Issued |
| ISSUING COMMITTEE | AMS P Polymeric Materials Committee |
|---|---|
| DATE | 1979-10-01 |
| DOI | |
| ISCURRENT | |
| PAGE | 15 |
| PUBLISHER | SAE International |
| REVISED | ISSUED |
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