SAE ARP1612A PDF
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Polyimide Printed Circuit Boards Fabrication of
Description
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
History
| ARP1612A | 2022-06-05 | Latest | Reaffirmed |
| ARP1612 | 1979-10-01 | Historical | Issued |
| ISSUING COMMITTEE | AMS P17 Polymer Matrix Composites Committee |
|---|---|
| DATE | 2022-06-05 |
| DOI | |
| ISCURRENT | Current |
| PAGE | 18 |
| PUBLISHER | SAE International |
| REVISED | REAFFIRMED |
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